The Engineering Library recently purchased access to the CINDAS Materials Properties data files:
- Aerospace Structural Metals Database (ASMD)
- Thermophysical Properties of Matter Database (TPMD)
- Microelectronics Packaging Materials Database (MPMD)
The ASMD is provided through a Cooperative Research and Development Agreement with the United States Air Force. It contains approximately 80,000 data curves on over 200 alloys used in the aerospace and other industries. It is updated annually with carefully selected new alloys.
The TPMD contains thermophysical properties of over 5,000 materials with approximately 50,000 data curves. This is the searchable, electronic version of the Thermophysical Properties of Matter data series available in a Web-based format. The database is continually updated and expanded.
The MPMD contains data and information on thermal, mechanical, electrical and physical properties of electronics packaging materials, available in a Web-based format. The database has over 750 materials and 15,000 data curves and is continually updated and expanded and offers online tutorials!
CINDAS LLC is a private company formed exclusively to disseminate materials properties data collected and analyzed by the Center for Information and Numerical Data Analysis and Synthesis (CINDAS) at Purdue University.
Slide shows and demos can be found at: